Apple continues to strengthen its independence from third-party suppliers by focusing on its own technology. According to the latest information, the company has intensified the development of new components for future smartphones, in particular chips for communication, Wi-Fi and Bluetooth. It is expected that by 2026, these modules could completely replace solutions from Qualcomm and other partners.
In 2025, Apple will unveil the iPhone 17 Air, an ultra-thin model about 5mm thick that will replace the Plus series. The move is in line with the trend to reduce size without losing functionality. As sources note, the iPhone 17 Air will be the first phone with a proprietary Baseband chip, a major milestone in Apple’s strategy to control hardware. In February 2024, the company launched the iPhone 16E, which features the C1 chip, Apple’s first 5G modem manufactured using TSMC’s 4nm process. While its performance is not yet up to Qualcomm’s level, its main advantage is its low power consumption, which improves the device’s battery life.
By 2026, with the release of the iPhone 18, Apple plans to switch entirely to its own Wi-Fi and Bluetooth solutions. This will improve component integration, optimise iOS performance and reduce costs. The introduction of its own chips is part of the company’s strategy, similar to the transition to M-series processors for Macs, which allows Apple to control the entire manufacturing process and accelerate innovation. While early chips like the C1 are inferior to market peers, Apple is willing to invest in technology development to achieve parity.
In 2025, iPhone 17 will remain in three versions: standard, Pro and Pro Max, while Plus will replace Air, emphasising the focus on innovative design. The integration of proprietary components into the iPhone 17 Air will form the basis for the larger changes in iPhone 18.The success of this strategy depends on Apple’s ability to combine miniaturisation and high performance to strengthen its position in the premium smartphone market.